december 2011 ? 2011 fairchild semiconductor corporation www.fairchildsemi.com FAN5904 ? rev. 3.0.5 FAN5904 ? multi-mode buck converter for gsm/edge, 3g/3.5g and 4g pas FAN5904 multi-mode buck converter for gsm/edge, 3g/3.5g and 4g pas features ? 2.7v to 5.5v input voltage range ? v out range from 0.40v to 3.50v (or v in ) ? single 470nh small form factor inductor ? 35m ? integrated bypass fet ? 100% duty cycle for low dropout operation ? input under-voltage lockout / thermal shutdown ? 1.71mm x 1.71mm, 16-bump, 0.40mm pitch wlcsp ? high power pwm mode o up to 95% efficient synchronous operation in high p out conditions o output current up to 2.3a o 10s output voltage step response for early gsm tx power-loop settling o 3mhz pwm mode ? low power auto mode o up to 95% efficient synchronous operation at higher p out conditions o output current up to 1.2a o 10s output voltage step response for early tx power-loop settling o 6mhz pwm operation at high power and pfm operation at low power ? bypass mode o up to 3a load current applications ? dynamic supply bias for polar or linear gsm/edge pas and 3g/3.5g and 4g pas ? dynamic supply bias for gsm/edge quad band amplifiers for mobile handsets and data cards description the FAN5904 is a high-efficiency, low-noise, synchronous, step-down, dc-dc converter optimized for powering radio frequency (rf) power amplifiers (pas) in handsets and other mobile applications. in high-power mode, gsm tx power is enabled. in low-power mode, up to 3.0w is supported, enabling up to 29dbm output power for 3g/3.5g and 4g platforms. the output voltage may be dynamically adjusted from 0.40v to 3.50v, proportional to an analog input voltage vcon ranging from 0.16v to 1.40v, optimizing power-added efficiency. fast transition times of less than 10s are achieved, allowing excellent inter-slot settling. an integrated bypass fet is automatically enabled when the battery voltage and voltage drop across the dc-dc pmos device are within a set voltage range of the desired output voltage (v out = v bat - v pmos - v bp_th ). this dynamic bypass feature enables the FAN5904 to support heavy load currents under the most stringent vswr conditions while maintaining high efficiency and superior spectral performance. the bypass fet may also be enabled by providing a vcon voltage nominally greater than or equal to 1.5v or by driving bpen high. the FAN5904 operates in pwm mode with a 6mhz switching frequency in low-power mode and at 3mhz in high-power mode, which limits high-frequency spur levels. it uses a single, small form factor inductor of 470nh. in addition, pfm operation is allowed in low-power mode to improve efficiency at low load currents. the FAN5904uc00x option allows pfm mode only when v out is less than 1v, while the FAN5904uc01x permits pfm mode at higher voltages for applications that can tolerate larger output ripple and that demand optimal low-to- moderate load current efficiency. ordering information part number lpm mode pfm output voltage temperature range package packing FAN5904uc00x v out < 1v 0.4v to pvin -40c to +85c 1.71mm x 1.71mm, 16-bump 0.4mm pitch, wafer-level chip-scale package (wlcsp) tape and reel FAN5904uc01x all v out
? 2011 fairchild semiconductor corporation www.fairchildsemi.com FAN5904 ? rev. 3.0.5 22 FAN5904 ? multi-mode buck converter for gsm/edge, 3g/3.5g and 4g pas physical dimensions product d e x y unit FAN5904uc00x 1.710 0.030 1.710 0.030 0.255 0.255 mm FAN5904uc01x 1.710 0.030 1.710 0.030 0.255 0.255 mm figure 60. 1.71x1.71mm square, 16 bumps, 0.4mm pitch, wlcsp package drawings are provided as a service to customers considering fairchild component s. drawings may change in any manner wit hout notice. please note the revision and/or date on the drawing and contact a fairchild semi conductor representative to verify or o btain the most recent revision. package specific ations do not expand the terms of fairchild?s worldwide terms and conditi ons, specifically the warranty therein, which covers fairchild products. always visit fairchild semiconductor?s online packa ging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ bottom view side views top view recommended land pattern ball a1 index area 1 2 3 4 a b c d seating plane 16x a1 0.005 cab f (nsmd pad type) ?0.2600.02 0.40 0.40 (x) 0.018 (y) 0.018 0.625 0.547 0.06 c 0.05 c e d f 0.3780.018 0.2080.021 notes: a. no jedec registration applies. b. dimensions ar e in millimeters. c. dimensions and tolerance per asme y14.5m, 1994. d. datum c is defined by the spherical crowns of the balls. e. package nominal he ight is 586 microns 39 microns (547-625 microns). f. for dimensions d, e, x, and y see product datasheet. g. drawing filnam e: mkt-uc016aarev2. 0.03 c 2x 0.03 c 2x e d b c a 0.40 0.40 (?0.20) cu pad (?0.30) solder mask opening
? 2011 fairchild semiconductor corporation www.fairchildsemi.com FAN5904 ? rev. 3.0.5 23 FAN5904 ? multi-mode buck converter for gsm/edge, 3g/3.5g and 4g pas
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